MFM1200 Bond Tester is a multifunctional manual testing instrument that can be applied in all tensile and shear testing. Based on different demands, it can be equipped with a variety of test modules. In addition to the conventional test modules, special test modules such as cold bump pull, hot bump pull, forceps tension, passivation shear testing can also be added.

MFM1200 Bond Tester is applicable for semiconductor industry, LED industry and a series of high reliability industries, supporting destructive and non-destructive testing.

* Powerful special software and easy operation
* Perfectly match the factory SPC system
* Standard configuration: XY operation stage of 100 x 100 mm
* With Auto-Range technology, there is no need to manually set sensor range before testing.
* It supports testing with maximum shear force of 200 KG.