Welcome to

TRY-PRECISION
Precision Technology

As a high-tech enterprise focusing on the research, production,
and sales of the semiconductor microelectronics precision testing system,
TRY has gained international recognition and trust.

ABT Series Fully Automatic

Bond Tester

It has the absolute leading mechanical precision,
machine vision and excellent reliability in the industry at present.

ABT2000W

INTEGRA

Advanced Automatic Wafer Testing Technology

By virtue of the most cutting-edge dynamic sensor technology, the most
integrated automatic control technology and the most advanced I_SEE
intelligent image recognition system, ABT2000W can be used for testing
the 4-12 inch wafers, providing unparalleled accuracy, repeatability and
result stability.

ABT2000

Fully Automatic Bond Tester

It dominates the industry due to its leading technology, image recognition technology and
automation.Automatic detection, optional automatic feeding and unloading system. Auto
matic image recognition and positioning technology, and independently developed motion
control system

Testing accuracy: ± 0.1% FS (industrial grade) ± 0.05% FS (analytical grade)
Functions: Wire Pull / Ball Shear / Die Shear testing and other destructive or non-destruc
tive tests.
Application fields: integrated circuit packaging, wafer manufacturing,
research institutions, packaging manufacturing of high reliability integrated
circuit chips, etc.
Technology: it has the absolute leading mechanical precision, machine vision and excellent
reliability in the industry.
Customers: NAURA, Shilan Microelectronics, Zhenhua Microelectronics, Sanan Optoelec
tronics, STMicroelectronics, Huawei, ROHM, etc.

MFM Series-MFM1200L

MFM1200L Bond Tester is a multifunctional manual testing instrument that can be
applied in all tensile and shear testing. Based on different demands, it can be equipped
with a variety of test modules. In addition to the conventional test modules, special
test modules such as cold bump pull, hot bump pull, forceps tension, passivation shear
testing can also be added.

Applications: MFM1200 Bond Tester is applicable for semiconductor industry, LED
industry and a series of high reliability industries, supporting
destructive and non-destructive testing.

Main Features:
* Powerful special software and easy operation
* Perfectly match the factory SPC system
* Standard configuration: XY operation stage of 100 x 100 mm
* With Auto-Range technology, there is no need to manually set
sensor range before testing.
* It supports testing with maximum shear force of 200 KG.

MFM Series-MFM1500HF

MFM1500HF Bond Tester is a multifunctional manual testing instrument that can be applied
in all tensile and shear testing. Based on different demands, it is equipped with a
variety of test modules, and supports the thrust test with maximum shear force of 1000 KG.

Applications: High-power IC packaging IGBT, circuit manufacturing, glue manufacturing, etc.

Main Features:
* Powerful special software and easy operation
* Perfectly match the factory SPC system
* Standard configuration: XY operation stage with 150 x 150 mm
* With Auto-Range technology, there is no need to manually set sensor range before testing.
* It supports the testing with a maximum shear force of 1000 KG