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MFM Series / MFM1500HS High Speed Bond Tester
Technical Manual
Product Introduction
High-speed Shear Test
The high speed test regime requires an area in which the tool can accelerate before contacting the BGA ball, This is achieved by retracting the sample holder to an automatically calculated distance according to the speed chosen,Thus ,non-test balls must be cleared prior to the test.

High-speed Cold Bump Pull Test
Using the TRY-PRECISION patent technology, a special clamping device, to achieve the energy conversion in the horizontal direction to the vertical direction of the highspeed force test;

Data Analvsis
High sampling with wide bandwidth, high accuracy measurement; providing Force VS Distance Graph, Force VS Time Graph, Fracture Energy and other indicators.

Applications
* Brittle fracture joint analysis
* Alternative to drop testing
* Lead-free solder joint evaluation
* BGA, CSP,PiP,PoP,SiP solder joint testing
* lmpact testing applications
* Pad finish and substrate evaluation
* Zone shear-testing multiple ball bonds simultaneously
MFM1500HS High Speed Bond Tester
Specifications
MFM 1500HS丨Specifications
Equipment Machine Size(W*D*H) 700mm x 900mm x 880mm
Weight 85kg
Power supply 110V AC 60Hz or 220V AC50Hz.10A
CDA 0.4MPa-0.6Mpa
System Win10 64Bit
Protector Standard & Protected test area
Test tool Customization Customize according to application requirements
Test module Highspeed shear force test BS 5kg (Precision:±1% FS)
Highspeed pull force test CBP 5kg (Precision:±1% FS)
Other specification test module Customized
Test speed Highspeed shear force test Adjustable,50 mm/s-2m/s
Highspeed pull force test Adjustable,50 mm/s -1 m/s
Axis X axis travel 100mm
Y axis travel 400mm
Z axis travel 70mm
product Other Product >
MFM Series / MFM1500HS High Speed Bond Tester
Technical Manual
MFM1500HS High Speed Bond Tester
Product Introduction
High-speed Shear Test
The high speed test regime requires an area in which the tool can accelerate before contacting the BGA ball, This is achieved by retracting the sample holder to an automatically calculated distance according to the speed chosen,Thus ,non-test balls must be cleared prior to the test.

High-speed Cold Bump Pull Test
Using the TRY-PRECISION patent technology, a special clamping device, to achieve the energy conversion in the horizontal direction to the vertical direction of the highspeed force test;

Data Analvsis
High sampling with wide bandwidth, high accuracy measurement; providing Force VS Distance Graph, Force VS Time Graph, Fracture Energy and other indicators.

Applications
* Brittle fracture joint analysis
* Alternative to drop testing
* Lead-free solder joint evaluation
* BGA, CSP,PiP,PoP,SiP solder joint testing
* lmpact testing applications
* Pad finish and substrate evaluation
* Zone shear-testing multiple ball bonds simultaneously
Specifications
MFM 1500HS丨Specifications
Equipment Machine Size(W*D*H) 700mm x 900mm x 880mm
Weight 85kg
Power supply 110V AC 60Hz or 220V AC50Hz.10A
CDA 0.4MPa-0.6Mpa
System Win10 64Bit
Protector Standard & Protected test area
Test tool Customization Customize according to application requirements
Test module Highspeed shear force test BS 5kg (Precision:±1% FS)
Highspeed pull force test CBP 5kg (Precision:±1% FS)
Other specification test module Customized
Test speed Highspeed shear force test Adjustable,50 mm/s-2m/s
Highspeed pull force test Adjustable,50 mm/s -1 m/s
Axis X axis travel 100mm
Y axis travel 400mm
Z axis travel 70mm
Other Product >
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Shenzhen TRY Precision Technology Co., Ltd.
Fax: +86 0755-2950-0254
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