Bond Tester plays a very important role in the semiconductor packaging industry. The wafer strength testing after Die Bond and the wire pull testing and ball shear test after wire bond are very important reference processes for mass production.

For the wafer testing, TRY PRECISION has launched the most advanced and fully automatic ABT series in the world on the basis of the traditional manual mode, which can achieve automatic testing and analysis function of failure mode through the precise positioning of camera and powerful software functions. This software also supports SECS/GEM communication protocol at the client end.

In the new era, the requirements for auto intelligence are getting higher and higher. Compared with the earlier products, more and more electronic components and electronic sensors are integrated in the automobiles nowadays. With the higher market requirements for the safety of products, auto electronics manufacturers are required to provide reliability testing requirements for their products. Therefore, MFM Series Bond Tester is launched to specifically design the fixtures and testing modules so as to meet the stringent testing and application requirements.

MFM series of TRY PRECISION provide targeted fixtures and large range test modules (1000 KG) for IGBT module testing to meet test requirements due to their sturdy body design.

In the modern information and communication network architecture, optical communication devices featured by large data volume, high bandwidth and high transfer speed become indispensable key components. MFM Series Equipment specially matches the testing components and testing clamps of precision manufacturing with metal tube shells such as TO series and other packaged laser components so as to ensure the reliability of precision testing.

With the rapid development of MINI LED, the requirements for product safety and reliability are increasing on the market day by day. In this aspect, TRY PRECISION has launched LMS series equipment to specially design for MINI LED fixtures, test modules and test environments so as to meet the stringent testing and application requirements.

The photovoltaic field has very high requirements for reliability. The polygon of the solar receiving panel operating environment and its long-term operation require that the panel strength and the surface film bond strength should be very firm. The MFM Series Bond Tester offers high thrust testing up to 500kg and Tp tweezer tensile testing up to 20kg, perfectly realizing the strength testing of panels and pull testing of films on panels.

With the trend of miniaturization of electronic products (such as smart phones, tablet computers, SSD, etc.), IC integration has been and will be higher and higher, and even the wafer is directly mounted. The manufacturing process requires extremely high precision. The direct testing capability of the MFM Series Bond Tester will help you build a more reliable manufacturing process.

With the popularization of new energy, TRY PRECISION has launched Hook A100 New Energy Power Battery Wire Bond Tension Testing System for power battery testing, which can be matched with customer’s production lines to carry out non-destructive testing (NDT).

As an important testing equipment selected by many scientific research institutions, the MFM Series Bond Tester of TRY is especially outstanding in terms of testing capacity and applicability when facing a wide variety of test samples from research institutions. Our flexible and customized testing tools are especially suitable for deep cavity devices and mixed package samples; the software version aiming at research organizations can even directly output the test report; besides, TP forceps tension test and CBP-BGA ball pulling test are available.

As an important testing equipment selected by many scientific research institutions, the MFM Series Bond Tester of TRY is especially outstanding in terms of testing capacity and applicability when facing a wide variety of test samples from research institutions. Our flexible and customized testing tools are especially suitable for deep cavity devices and mixed package samples; the software version aiming at research organizations can even directly output the test report; besides, TP forceps tension test and CBP-BGA ball pulling test are available.